Wafer Dicing Protective Film

Base film materials (CPE and PP)

Chlorinated polyethylene (CPE) film

A high-performance film with strong chemical resistance and excellent mechanical durability, optimized for precision protection.

- Chemical Resistance: High resistance to a wide range of chemicals, suitable for demanding processing environments

- Durability: Good mechanical strength, able to withstand physical stress

- Transparency: High optical clarity, suitable for wafer surface protection and inspection

Polypropylene (PP) film

A film with balanced performance and high cost-effectiveness, meeting general protection needs.

- Cost-effectiveness: More economical than specialty films, suitable for high-volume, cost-sensitive applications

- Transparency: Moderate optical clarity, meeting the visual requirements of most semiconductor processes

- Temperature resistance: Reliable performance in medium and low temperature environments

Key protective and functional properties

High transparency and clarity

Ensures the protected surface (e.g., wafer) is clearly visible, which is essential for quality control.

- Enables clear inspection of the wafer surface during dicing and handling

- Keeps surface details (e.g., defects, patterns) visible for precision quality inspection

Excellent adhesion

Strong adhesion firmly fixes the film to the target surface (e.g., wafer) without displacement.

- Prevents shifting or peeling during processing, handling, or transportation

- Provides stable and reliable protection throughout the production process

Protection against mechanical damage

Protects fragile surfaces (e.g., wafers, electronic components) from physical damage.

- Resistant to scratches, impact, and abrasion during dicing, handling, and storage

- Keeping sensitive surfaces (such as semiconductor wafers) intact and avoiding process failures

Contamination Prevention

Preventing particulate contaminants from depositing on protected surfaces.

- Preventing dust, dirt and other impurities from adhering to wafer or component surfaces

- Maintain cleanliness and precision, which are critical for semiconductor manufacturing and electronic assembly

Temperature and chemical resistance

Resistance levels vary by material type and can accommodate diverse processing conditions.

- Temperature resistance: PP is suitable for medium and low temperature environments; CPE may offer stronger resistance (depending on the material)

- Chemical Resistance: CPE offers strong chemical resistance; PP provides basic protection (depending on the application)

- Adapt to different processing environments (e.g., chemical cleaning, temperature-controlled storage)

Easy to apply, easy to remove

Simple to handle with minimal residue after use.

- Efficient application, helping to streamline production processes

- Clean removal with minimal residue, preventing surface contamination or damage after protection ends

Application Scenarios

Semiconductor manufacturing

Provides essential protection for wafers during key production steps.

- Wafer dicing: Prevent surface damage and ensure dicing precision

- Wafer handling and storage: Keep wafers intact during transport and storage, ensuring quality for subsequent processes

Electronic Component Protection

Used in the production and assembly of electronic components.

- Protect precision electronic components (such as microchips and sensors) from damage and contamination during manufacturing and assembly

- Keep surfaces clean to ensure reliable component performance

Laboratory & R&D

Protect samples and reagents in controlled environments.

- Prevent laboratory samples and reagents from contamination to ensure accurate experimental results

- Prevent physical damage to sensitive R&D materials (such as prototype parts)

Eco-Friendly & Safety Features

Eco-Friendly Options

Recyclable products are available (depending on material) to support sustainability goals.

- Use recyclable formulations to reduce plastic waste

- Support eco-friendly practices in industrial and laboratory environments (availability varies by material type)

Safety & Compliance

Manufactured with non-toxic materials and compliant with industrial safety standards.

- Comply with safety regulations for electronic and industrial applications

- Eliminate the risk of toxic contamination to protected surfaces (such as wafers and components) or laboratory samples